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3.0mm2.5mm tin suction wire desoldering wire solder removal lead
feature
1. Braided design-The copper core adopts a finely braided design which can enhance the capillary action to absorb excess solder.
2. When removing tin it is used to absorb excess solder. It has anti-oxidation and anti-corrosion effects and has good thermal conductivity and tin plating effect.
3. When soldering IC and other components when connecting the pins to the tin you should use a tin suction wire and the tin stuck on the pins can be sucked away. Make sure there is no short circuit between the pins.
4. In addition when implanting BGA components please use solder wire to clean the pads of BGA components which greatly improves the success rate of implanting balls.
5. Suitable for all kinds of electronics electrical appliances precision instruments and meters.
Product parameter
Material: Copper wire
Product model: CP-1515 / 2015/2515/3015/3515
Size: 3.0mm * 1.5m / 2.5mm * 1.5m
Instructions
1.Put the solder remover lead on the solder that needs to be removed and then push the heated soldering iron tip onto the coil of the tin suction wire.
2.Remove the solder wire immediately after absorbing the solder.
3.Cut off the used part of the core ring of the suction tin wire.
Package content:
1 *Solder remover core wire
notes:
1. Since it is a manual measurement please allow a difference of 1-3mm thank you!
2. Due to the difference between different monitors please note that the picture may not reflect the actual color of the item.
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